MPC8572ECLVTAULE
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| NXP Semiconductors | ||
| Product content declaration of MPC8572ECLVTAULE | Last Revision (GMT): Tuesday, 18 March 2025, 05:16:00 PM | |
| Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | For more information: | |||
|---|---|---|---|---|---|---|---|---|---|---|
| Halogen Free (Cl+Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
| MPC8572ECLVTAULE | SOT1619-1 | BGA1023 | 12908.786000 mg | Yes | No | Yes | Tin/Silver (Sn/Ag) | Other | e2 | contact us |
| Manufacturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
|---|---|---|---|---|---|---|---|---|---|---|
| Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | |||||
| 9353 173 91557 | 2024-02-06 | 6 | Not Applicable | Not Applicable | Not Applicable | 3 / 168 hours | 245 | 30 sec. | 3 | Kuala Lumpur, Malaysia;External manufacturing |
| Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | |
|---|---|---|---|---|---|---|---|
| Category | Description | ||||||
| Capacitor | Capacitor | Barium and its compounds | Barium titanate | 12047-27-7 | 47.629512 | 65.400000 | 0.368970 |
| Copper and its compounds | Copper, metal | 7440-50-8 | 10.050264 | 13.800000 | 0.077856 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 14.201460 | 19.500000 | 0.110014 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 0.946764 | 1.300000 | 0.007334 | ||
| Subtotal | 72.828000 | 100.0000000 | 0.564174 | ||||
| Epoxy Adhesive | Epoxy Adhesive | Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 32.400000 | 45.000000 | 0.250992 |
| Organic compounds | Proprietary Material-Allyl ether compounds | 7.200000 | 10.000000 | 0.055776 | |||
| Polymers | Plastic: EP - Epoxide, Epoxy | 32.400000 | 45.000000 | 0.250992 | |||
| Subtotal | 72.000000 | 100.0000000 | 0.557760 | ||||
| Heat Spreader | Heat Spreader | Copper and its compounds | Copper, metal | 7440-50-8 | 7437.693600 | 99.969000 | 57.617297 |
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 2.232000 | 0.030000 | 0.017291 | ||
| Phosphorus compounds | Phosphorus, elemental (not containing red allotrope) | 7723-14-0 | 0.074400 | 0.001000 | 0.000576 | ||
| Subtotal | 7440.000000 | 100.0000000 | 57.635164 | ||||
| Semiconductor Die | Semiconductor Die | Inorganic Silicon compounds | Silicon, doped | 309.444300 | 89.100000 | 2.397160 | |
| Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 32.707672 | 9.417700 | 0.253375 | ||
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 3.125700 | 0.900000 | 0.024214 | |||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.286523 | 0.082500 | 0.002220 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 1.721219 | 0.495600 | 0.013334 | ||
| Titanium and its compounds | Titanium, metal | 7440-32-6 | 0.014587 | 0.004200 | 0.000113 | ||
| Subtotal | 347.300000 | 100.0000000 | 2.690416 | ||||
| Solder Ball - Lead Free | Solder Ball - Lead Free | Antimony and its compounds | Antimony, metal | 7440-36-0 | 0.816146 | 0.095100 | 0.006322 |
| Arsenic and its compounds | Arsenic, metal | 7440-38-2 | 0.074663 | 0.008700 | 0.000578 | ||
| Bismuth and its compounds | Bismuth, metal | 7440-69-9 | 0.343279 | 0.040000 | 0.002659 | ||
| Iron and its compounds | Iron, metal | 7439-89-6 | 0.300369 | 0.035000 | 0.002327 | ||
| Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 0.019739 | 0.002300 | 0.000153 | ||
| Silver and its compounds | Silver, metal | 7440-22-4 | 30.066109 | 3.503400 | 0.232912 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 826.577695 | 96.315500 | 6.403218 | ||
| Subtotal | 858.198000 | 100.0000000 | 6.648170 | ||||
| Solder Flux | Solder Flux | Aliphatic Amines | Other aliphatic amines | 0.112140 | 0.210000 | 0.000869 | |
| Aluminum and its compounds | Aluminum, metal | 7429-90-5 | 0.000534 | 0.001000 | 0.000004 | ||
| Antimony and its compounds | Antimony, metal | 7440-36-0 | 0.053400 | 0.100000 | 0.000414 | ||
| Arsenic and its compounds | Arsenic, metal | 7440-38-2 | 0.005287 | 0.009900 | 0.000041 | ||
| Bismuth and its compounds | Bismuth, metal | 7440-69-9 | 0.016020 | 0.030000 | 0.000124 | ||
| Cadmium and its compounds | Cadmium, metal | 7440-43-9 | 0.001068 | 0.002000 | 0.000008 | ||
| Copper and its compounds | Copper, metal | 7440-50-8 | 0.261126 | 0.489000 | 0.002023 | ||
| Gold and its compounds | Gold, metal | 7440-57-5 | 0.002670 | 0.005000 | 0.000021 | ||
| Iron and its compounds | Iron, metal | 7439-89-6 | 0.010680 | 0.020000 | 0.000083 | ||
| Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 0.026700 | 0.050000 | 0.000207 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.005340 | 0.010000 | 0.000041 | ||
| Silver and its compounds | Silver, metal | 7440-22-4 | 1.433790 | 2.685000 | 0.011107 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 51.459978 | 96.367000 | 0.398643 | ||
| Zinc and its compounds | Zinc, metal | 7440-66-6 | 0.011267 | 0.021100 | 0.000087 | ||
| Subtotal | 53.400000 | 100.0000000 | 0.413672 | ||||
| Substrate | Substrate | Barium and its compounds | Barium sulfate | 7727-43-7 | 12.182738 | 0.310800 | 0.094376 |
| Copper and its compounds | Copper, metal | 7440-50-8 | 1259.298467 | 32.126600 | 9.755359 | ||
| Epoxy Resins | Proprietary Material-Other Non-halogenated Epoxy resins | 812.684294 | 20.732800 | 6.295590 | |||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 1776.265210 | 45.315200 | 13.760126 | ||
| Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 3.719890 | 0.094900 | 0.028817 | ||
| Silver and its compounds | Silver, metal | 7440-22-4 | 1.485604 | 0.037900 | 0.011508 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 54.163796 | 1.381800 | 0.419589 | ||
| Subtotal | 3919.800000 | 100.0000000 | 30.365365 | ||||
| Thermally Conductive Gel | Thermally Conductive Gel | Aluminum and its compounds | Aluminum, metal | 7429-90-5 | 54.472500 | 75.000000 | 0.421980 |
| Organic Silicon compounds | Proprietary Material-Other organic silicon compounds | 7.263000 | 10.000000 | 0.056264 | |||
| Zinc and its compounds | Zinc, metal | 7440-66-6 | 10.894500 | 15.000000 | 0.084396 | ||
| Subtotal | 72.630000 | 100.0000000 | 0.562640 | ||||
| Underfill | Underfill | Epoxy Resins | Other Non-halogenated Epoxy resins | 7.263000 | 10.000000 | 0.056264 | |
| Epoxy Resins | Phenolic Polymer Resin, Epikote 155 | 9003-36-5 | 12.347100 | 17.000000 | 0.095649 | ||
| Inorganic Silicon compounds | Proprietary Material-Other silica compounds | 5.810400 | 8.000000 | 0.045011 | |||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 47.209500 | 65.000000 | 0.365716 | ||
| Subtotal | 72.630000 | 100.0000000 | 0.562640 | ||||
| Total | 12908.786000 | 100.0000000 | 100.0000000 | ||||
| Note(s): |
|---|
| 1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| 产品内容声明 MPC8572ECLVTAULE Product content declaration of MPC8572ECLVTAULE | 上次修订 Last Revision (GMT): Tuesday, 18 March 2025, 05:16:00 PM | |
| 部件名称 Name of the part | 均质材料 Homogeneous Material | 有毒或有害物质和元素 (Toxic or hazardous Substances and Elements) | |||||
|---|---|---|---|---|---|---|---|
| 铅(Pb) | 镉(Cd) | 汞(Hg) | 六价铬(Cr-VI) | 多溴联苯(PBB) | 多溴二苯醚(PBDE) | ||
| 电容器 Capacitor | 电容器 Capacitor | O | O | O | O | O | O |
| 环氧树脂粘合剂 Epoxy Adhesive | 环氧树脂粘合剂 Epoxy Adhesive | O | O | O | O | O | O |
| 散热片 Heat Spreader | 散热片 Heat Spreader | O | O | O | O | O | O |
| 半导体芯片 Semiconductor Die | 半导体芯片 Semiconductor Die | X | O | O | O | O | O |
| 焊锡球-无铅 Solder Ball - Lead Free | 焊锡球-无铅 Solder Ball - Lead Free | O | O | O | O | O | O |
| 助焊剂 Solder Flux | 助焊剂 Solder Flux | O | O | O | O | O | O |
| 基板 Substrate | 基板 Substrate | O | O | O | O | O | O |
| 导热凝胶 Thermally Conductive Gel | 导热凝胶 Thermally Conductive Gel | O | O | O | O | O | O |
| 底注 Underfill | 底注 Underfill | O | O | O | O | O | O |
| O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。 |
| O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit. |
| X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。 |
| X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006. |
| 备注： 该半导体产品的环保使用期限（EFUP）为50年。 |
| Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years. |
| 免责声明 Disclaimer |
|---|
| 本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| Compliance Documentation of MPC8572ECLVTAULE | Last Revision (GMT): Tuesday, 18 March 2025, 05:16:00 PM | |
| Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
|---|---|---|---|---|---|
| RoHS | Phthalates * | Halogens * | Antimony * | ||
| Capacitor | CERAMIC | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 |
| INNER ELECTRODE | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | |
| NI PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| OUTER ELECTRODE | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | |
| SN PLATING | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | Test Report 28 Mar 2025 | |
| Epoxy Adhesive | Test Report 10 Mar 2021 | Test Report 10 Mar 2021 | Not Available | Not Available | |
| Heat Spreader | Not Available | Not Available | Not Available | Not Available | |
| Semiconductor Die | Test Report 24 Feb 2025 | Test Report 24 Feb 2025 | Test Report 24 Feb 2025 | Test Report 24 Feb 2025 | |
| Solder Ball - Lead Free | Test Report 6 Aug 2024 | Test Report 6 Aug 2024 | Test Report 6 Aug 2024 | Test Report 6 Aug 2024 | |
| Solder Flux | Test Report 10 Jan 2025 | Test Report 10 Jan 2025 | Test Report 10 Jan 2025 | Test Report 10 Jan 2025 | |
| Substrate | AUS 703 | Test Report 18 Mar 2025 | Test Report 18 Mar 2025 | Test Report 18 Mar 2025 | Test Report 18 Mar 2025 |
| CU FOIL | Test Report 28 Nov 2024 | Test Report 28 Nov 2024 | Test Report 28 Nov 2024 | Test Report 28 Nov 2024 | |
| E679FG SERIES | Test Report 28 Nov 2024 | Test Report 7 Dec 2023 | Not Available | Not Available | |
| E679FGB SERIES | Not Available | Not Available | Test Report 7 Dec 2023 | Test Report 7 Dec 2023 | |
| GX-13 | Test Report 3 Feb 2025 | Test Report 3 Feb 2025 | Test Report 3 Feb 2025 | Test Report 3 Feb 2025 | |
| SR 7200 | Test Report 27 Mar 2020 | Test Report 27 Mar 2020 | Test Report 27 Mar 2020 | Test Report 27 Mar 2020 | |
| Thermally Conductive Gel | Test Report 31 Jul 2024 | Test Report 31 Jul 2024 | Test Report 31 Jul 2024 | Test Report 31 Jul 2024 | |
| Underfill | Not Available | Not Available | Not Available | Not Available | |
| For more information: contact us | |||||
| Note(s): |
|---|
| * NXP does not commit to providing this report for all product materials! |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |