i.MX 8ULP Applications Processor Family

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Block Diagram

i.MX 8ULP Applications Processors

i.MX8ULP Applications Processors Block Diagram

Features

CPU

  • Up to two Arm® Cortex®-A35 @ 800 MHz
  • Arm Cortex-M33 @ 216 MHz
  • Cadence® Tensillica® Hi-Fi 4 DSP @475 MHz for advanced audio, voice and ML processing and Fusion DSP @200 MHz for low-power voice and sensor hub processing
  • EdgeLock™ secure enclave
  • RISC-V powered Power Management Subsystem (µpower)

Memory

  • 896 KB Total On Chip SRAM

External Memory

  • LPDDR3/LPDDR4/LPDDR4X
  • SPI-NOR
  • SPI-NAND

Graphics

  • 3D GPU includes: Open GL® ES 3.1, OpenCL™ , Vulkan® and Open VG1.1
  • 2D GPU
  • MIPI DSI (4-lane) with PHY
    • Up-to 24-bit RGB (DBI/DPI)
  • Color EPD Display

Connectivity

  • 10/100 Ethernet
  • FlexCAN

Display/Camera

  • MIPI CSI (2-lane) with PHY
  • (ISI) module interfaces: 1 pixel link source to obtain the image data for processing in its pipeline channels

Packaging

  • FCCSP 9.4 X 9.4 mm²
  • MAPBGA 15 x 15 mm²

Temperature Range

  • Industrial (-40 °C to 105 °C)
  • Commercial (0 °C to 95 °C)

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Documentation

Quick reference to our documentation types.

1-10 of 35 documents

Compact List

Application Note (17)
Application Note Software (3)
Brochure (2)
Data Sheet (2)
Errata (1)
Fact Sheet (2)
Reference Manual (1)
Technical Notes (1)
User Guide (2)
White Paper (4)

Design Files

Hardware

Quick reference to our board types.

4 hardware offerings

Software

Quick reference to our software types.

5 software files

Note: For better experience, software downloads are recommended on desktop.

Engineering Services

1-5 of 15 engineering services

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Training

3 trainings