1x1 Dual-band Wi-Fi® 5 (802.11ac) and Bluetooth®5.2 Combo Solution
2.4/5 GHz Dual-Band 1x1 Wi-Fi® 6 (802.11ax) + Bluetooth® 5.4 + 802.15.4 Tri-Radio Solution
The IW612 is a highly integrated 2.4/5 GHz dual-band 1x1 Wi-Fi 6, Bluetooth/Bluetooth Low Energy 5.4 and 802.15.4 tri-radio single-chip solution optimized for a broad array of IoT and industrial applications in smart home, smart devices and accessories, smart appliances, smart energy, industrial automation, gateways and many more. This high degree of integration contributes to very low system costs and a minimum external BOM while achieving efficient coexistence between all internal radios as well as external radios, such as LTE.
IW612 includes a full-feature Wi-Fi subsystem powered by NXP’s 802.11ax (Wi-Fi 6) technology bringing higher throughput, better network efficiency, lower latency and improved range over previous generation Wi-Fi standards. The Wi-Fi subsystem integrates a Wi-Fi MAC, baseband and direct-conversion radio with integrated PA, LNA and transmit/receive switch removing the need for an RF front-end module (FEMs) saving cost and reducing system complexity.
In addition to a Wi-Fi 6 radio, the IW612 integrates an independent Bluetooth 5.4 and 802.15.4 subsystem that supports Thread, Zigbee and Dual PAN mesh networks. The device features Bluetooth Profiles such as hands free (HFP), advanced audio distribution profile (A2DP) for audio streaming as well as additional profiles like dual wideband speech (WBS). For Bluetooth Low Energy, the IW612 enables 2 Mbit/s high-speed data rate, long range and extended advertising. Finally, LE Audio is supported using Isochronous channels for a better overall audio experience.
The IW612 integrates dedicated CPUs and memories for both the Wi-Fi and Bluetooth/802.15.4 subsystems, which enable real time, independent protocol processing. Interfaces for connecting the IW612 to external host processors include SDIO 3.0 for Wi-Fi, UART for Bluetooth and SPI for 802.15.4.
Wireless modules based on the NXP IW612 are offered by leading module manufacturers.
Product Details
Block Diagram
Choose a diagram:
Features
Wi-Fi Key Features
- 1x1 2.4/5 GHz, up to 80 MHz channel
- UL/DL MU-MIMO and OFDMA
- Target Wake Time, Dual Carrier Modulation, Extended Range
- 802.11az accurate ranging
- WPA3 security
- SDIO 3.0 host interface
Bluetooth Key Features
- Supports Bluetooth 5.2 features
- Bluetooth 5.4 certified
- Integrated high power PA up to +20 dBm transmit power
- Full featured Bluetooth baseband
- SCO/eSCO links with hardware accelerated audio signal processing
- Bluetooth LE 2 Mbit/s, Long Range, Advertising Extensions
- LE Audio with Isochronous channels
- UART host interface
802.15.4 Key Features
- IEEE 802.15.4 compliant supporting Thread, Zigbee and Dual PAN in 2.4 GHz band
- Integrated high power PA up to +20 dBm transmit power
- Shared transmitter and antenna pin with Bluetooth
- Simultaneous receive with Bluetooth
- SPI host interface
General Features
- Dedicated, independent CPUs and memories for Wi-Fi and Bluetooth
- Efficient power management system supporting deep-sleep low-power mode
- Single and dual antenna configurations
Partner Modules
IW612
Wi-Fi 6 (802.11ax) 5.2 + 802.15.4 Tri-Radio Solution GHz Dual-Band 1x1 + Bluetooth® 5.1| Product | Wi-Fi I/F | Bluetooth I/F | Operating Temp | Antenna Type | Antenna # | Module Type | Module Size | Qualifications | Recommended Host |
|---|---|---|---|---|---|---|---|---|---|
|
AW-PU600 |
- | - | 0 to 70 | MHF4 connector(s) | 1 | OSM-L | 45 x 45 | CE, FCC, IC, Japan | i.MX93 |
|
AW-XH320 |
SDIO | UART | -40 to 85 | Antenna pin(s) | 1 | SiP | 8 x 8 x 1.35 | NA | i.MX / i.MX RT |
|
AW-XM549 |
SDIO | UART | 0 to 70 | Antenna pin(s) | 1 | SMD | 12 x 12 x 1.99 | CE, FCC, IC, Japan | i.MX 93, RT1060 |
|
AW-XM549-I |
SDIO | UART | -40 to 85 | Antenna pin(s) | 1 | SMD | 12 x 12 x 1.99 | CE, FCC, IC, Japan | i.MX 93, RT1060 |
|
CMP9612-9-R |
SDIO | UART | -40 to 85 | RF PIN | 1 | SMD | 12 x 12 x 2 | N/A | i.MX 93, RT1060 |
|
CMP9612-2C-R |
SDIO | UART | -40 to 85 | u.FL | 1 | SMD | 16.64 x 27.8 x 3.47 | FCC IC CE | i.MX 93, RT1060 |
|
CMP9612-2-R |
SDIO | UART | -40 to 85 | PCB-trace | 1 | SMD | 16.64 x 27.8 x 3.47 | FCC IC CE | i.MX 93, RT1060 |
|
CMP9612-1C-R |
SDIO | UART | 0 to 70 | U.FL Connector(s) | 1 | SMD | 16.64 x 27.8 x 3.47 | FCC IC CE | i.MX 93, RT1060 |
|
CMP9612-1-R |
SDIO | UART | 0 to 70 | PCB-trace | 1 | SMD | 16.64 x 27.8 x 3.47 | FCC IC CE | i.MX 93, RT1060 |
|
SPB438 |
4-bit SDIO 3.0 | UART | -40 to 85 | MHF 4 Connector(s) | 1 | M.2 E-Key | 22 x 30 x 2.5 | FCC, IC, CE | i.MX 93, RT1060 |
|
LBES5PL2EL-923 |
SDIO | UART | -40 to 85 | Antenna pin(s) | 2 | SMD | 8.8 x 7.7 x 1.3 | CE, FCC, IC, MIC (Japan) | i.MX 93, RT1060 |
|
ENWF9511C1KF |
SDIO | UART | -40 to 85 | Antenna pin(s) | 1 | SMD | 15.3 x 12 x 2.5 | EU, CE RED, FCC, ISED | i.MX 93, RT1060 |
|
M2-MAYA-W271-00C |
SDIO | UART, PCM/I²S | -40 to 85 | U.FL Connectors | 2 | M.2 card | 22.0 x 30.0 x 2.8 | HW qual: ISO-16750; FCC/ISED, RED/UKCA,BTSIG | i.MX 93, RT1060 |
|
MAYA-W271-00B |
SDIO | UART, PCM/I²S | -40 to 85 | Antenna pin(s) | 2 | SMD | 10.4 x 14.3 x 1.9 | HW qual: ISO-16750; FCC/ISED, RED/UKCA,GITEKI,NCC,KCC,ANZ,BTSIG | i.MX 93, RT1060 |
|
MAYA-W276-00B |
SDIO | UART, PCM/I²S | -40 to 85 | Emb. Antenna / pin | 1 | SMD | 10.4 x 14.3 x 1.9 | HW qual: ISO-16750; FCC/ISED, RED/UKCA,GITEKI,NCC,KCC,ANZ,BTSIG | i.MX 93, RT1060 |
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Documentation
Quick reference to our documentation types.
1-10 of 32 documents
Compact List
Application Note (18)
-
Coexistence Overview for IW612[AN13382]
Brochure (1)
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Smart Cooking with Matter[MATTER-SMART-COOKING-BR]
Data Sheet (1)
Fact Sheet (1)
Reference Manual (1)
User Manual (10)
Design Resources
Hardware
Quick reference to our
board types.
5 hardware offerings
-
Evaluation and Development Boardsi.MX 93 Evaluation Kit
Active -
Evaluation and Development BoardsMPU / Linux® Hosted Matter Development Platform
-
Evaluation and Development BoardsMCU / RTOS Hosted Matter Development Platform
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Additional hardware available. View our featured partner solutions.
-
Evaluation and Development Boardsi.MX 8ULP Evaluation Kit
-
Evaluation and Development BoardsFRDM i.MX 93 Development Board
Active
Software
Quick reference to our software types.
3 software files
-
HMI Design Software
GUI Guider
-
BSPs and Device Drivers
STM32 CMSIS PACK driver
-
Examples and Quick Start Software
MCUXpresso Software Development Kit (SDK)
Note: For better experience, software downloads are recommended on desktop.
Engineering Services
To get further assistance directly from NXP, please see our Engineering Services.
3 engineering services
-
Independent Design House (IDH)
Hardware Engineering
-
Independent Design House (IDH)
Design review
-
Test House and Certification
Country certifications
To find additional partner offerings that support this product, visit our Partner Marketplace.
Training
2 trainings